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ASM International N.V., a specialist in thin-film deposition for chips

L’essentiel

Based in the Netherlands, ASM International designs semiconductor manufacturing equipment, particularly for thin-film deposition at the atomic scale. Its technologies are used in the production of logic components, memory and power semiconductors.

À retenir

Based in the Netherlands, ASM International designs semiconductor manufacturing equipment, particularly for thin-film deposition at the atomic scale. Its technologies are used in the production of logic components, memory and power semiconductors.


ASM International N.V. occupies a specialized position in the semiconductor industrial supply chain: the company supplies the machines used to deposit certain materials onto the wafers on which chips are manufactured. Based in Almere, in the Netherlands, and listed on Euronext Amsterdam, it serves integrated circuit manufacturers, including foundries and memory producers. Its business relies on close coordination between materials chemistry, equipment engineering and expertise in industrial processes.

A history tied to the industrialization of semiconductors

Founded in 1968 by Arthur del Prado, ASM grew alongside the rise of microelectronics. The company gradually established an international presence, combining research, development, production and customer support in the main chip manufacturing regions. This footprint enables it to work closely with manufacturers whose new generations of components require several years of preparation.

Throughout its history, ASM has focused on deposition equipment for manufacturing steps performed on wafers. Atomic layer deposition, or ALD, has become a core specialty of the group. In 2022, the acquisition of Italy’s LPE also strengthened its offering in silicon carbide epitaxy, a material used particularly in power components.

Depositing material with precision

The principle of ALD is to grow a film through successive, controlled surface chemical reactions. This method allows extremely precise control over the deposited thickness and the coating of complex three-dimensional structures. It addresses a major challenge of miniaturization: achieving uniform electrical properties as transistor shapes become more elaborate and tolerances tighten.

ASM also offers epitaxy solutions, plasma-enhanced chemical vapor deposition and vertical furnaces. Epitaxy is used to grow a crystalline layer on a substrate while controlling its composition and properties. These different equipment families are used to create transistors and other circuit structures. Beyond selling machines, the company supplies parts, services and upgrades for its installed base.

What now?

The development of gate-all-around transistors, memory with three-dimensional architectures and new materials is placing greater demands on deposition processes. For ASM, the challenge is to translate these technical needs into reliable equipment capable of operating at scale with productivity levels compatible with factory constraints.

However, prospects remain tied to chip manufacturers’ investment cycles, trade restrictions and the concentration of demand among major customers. In silicon carbide, the pace of development also depends on electrification markets. ASM’s trajectory will therefore depend as much on the suitability of its processes as on its ability to support its customers’ industrial timelines.

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